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Investigation of heat transfer and flow properties in separated flow and reattachment regions for liquid sodium flow at fast reactors
(15.04.2021)
In many engineering applications, such as heating and cooling systems, flow around an automobile or building, separation and reattachment regions are formed. These regions are very important for controlling the amount of ...
A numerical investigation of heat transfer from heated surfaces of different shapes
(Pleiades Publishing, 15.04.2021)
The object of this study was cooling of inverted and plain triangular profile copper
surfaces at a constant heat flux of 1000 W/m2. The cooling of these triangular profile surfaces
placed at the bottom of a rectangular ...
THE EFFECT OF FIN ANGLE ON INCREASING THE HEAT TRANSFER FROM ELECTRONIC COMPONENTS BY APPLYING AN IMPINGING JET-CROSS FLOW
(12.11.2021)
With the advancement of technology, circuit elements in developing electronic devices heat up and their temperatures rise depending on the working load. Cross flow, which is one of the methods used to increase heat transfer ...
HEAT TRANSFER IMPROVEMENT IN MICROCHIP ELECTRONIC CIRCUIT ELEMENTS BY COMBINED JET EFFECT
(18.02.2022)
Elektronik devre üzerinde ne kadar çok mikroçip bulunabilirse o cihaz teknolojik olarak o denli gelişmiş olur. Fakat, küçük hacimlerde bulunan mikroçiplerin gelişimine engel olan aşırı ısınmaları sonucu sıcaklıklarının ...
A STUDY ON INCREASE COOLING CAPACITY OF MICROCHIPS WITH COMBINED JET FLOW
(19.03.2022)
Elektronikteki en son gelişmeler, çoğunlukla minyatürleştirme ve modern elektronik cihazların entegrasyonu için geliştirilmiş verimlilik, güvenilirlik ve uzun süreli etkili soğutma işlemlerini içermektedir. Bununla birlikte, ...
INVESTIGATION OF THE EFFECT OF FiN ANGLE AT COOLING OF HOT PLATES OF IMPINGING JET-CROSS FLOW WITH GRAPHENE OXIDE-WATER NANOFLUID
(18.06.2022)
The service life of modern, high-power, compact electronic components is affected by their heat dissipation capacity. It has become very important to cool the microchips, which are used in every stage of daily life and ...
RESEARCH OF THE EFFECT OF FIN DESIGN ON THE COOLING OF HEATED ELECTRONIC COMPONENTS IN A CHANNEL WITH IMPINGING JET-CROSS FLOW
(3.11.2021)
Elektronik bileşenler düşük voltaj akımda çalışırlar. Aşırı ısı, donanımların elektrik direncini düşürerek akımı artırır. Bunun sonucu olarak da cihazın performansında düşüş gözlenir. Bu durumu önlemek için elektronik ...
INVESTIGATION OF THE COMBINED JET FLOW EFFECT ON FLOW AND HEAT TRANSFER APPLICATION IN THE CHANNEL
(19.03.2022)
While advancement of technology makes the lives of consumers easier, it causes manufacturers to encounter some problems in order to develop longer-lasting and energy-efficient devices. The biggest problem in this matter ...
INVESTIGATION OF THE VARIATION OF COOLING PERFORMANCE WITH THE CHANNEL HEIGHT IN A CHANNEL HAVING IMPINGING JET-CROSS FLOW
(24.11.2021)
The cooling process by applying cross flow alone, which is one of the frequently used methods, may be insufficient for electronic circuit elements that reach high temperatures. Cooling with impinging jet, which is another ...
COOLING OF CIRCUIT ELEMENTS WHOSE TEMPERATURES INCREASED DEPENDING ON THE FIN POSITIONS IN AN IMPINGING JET-CROSS FLOW CHANNEL
(2021)
Gelişen teknoloji sayesinde devre elemanlarının boyutlarının küçülmesi ve artan işlemci kapasite ve hızları, elektronik elemanların sıcaklıklarının artmasına sebep olmaktadır. Cihazın sürdürülebilir bir şekilde çalışmasının ...
