Show simple item record

dc.contributor.authorZhou, Yang
dc.contributor.authorGuo, Lei
dc.contributor.authorZhao, Zhiheng
dc.contributor.authorZheng, Sisi
dc.contributor.authorXu, Yue
dc.contributor.authorXiang, Bin
dc.contributor.authorKaya, Savas
dc.date.accessioned2019-07-27T12:10:23Z
dc.date.accessioned2019-07-28T09:39:29Z
dc.date.available2019-07-27T12:10:23Z
dc.date.available2019-07-28T09:39:29Z
dc.date.issued2018
dc.identifier.issn0169-4243
dc.identifier.issn1568-5616
dc.identifier.urihttps://dx.doi.org/10.1080/01694243.2018.1426542
dc.identifier.urihttps://hdl.handle.net/20.500.12418/6536
dc.descriptionWOS: 000428583000007en_US
dc.description.abstractThe inhibition performance of domperidone on the corrosion of copper in different concentration of HCl solution has been investigated by electrochemical, weight loss, and surface analysis, and theoretical calculation methods. Results indicate that domperidone was found to be an effective inhibitor with the inhibition efficiency as high as 98.5% when the HCl concentration was 0.01M, and the corrosion rate of copper increased with the increment of HCl concentration from 0.001 to 1M. The potentiodynamic polarization results revealed that domperidone can be seen as a mixed type inhibitor when the HCl concentration was high (1 and 0.1M), while it acted as a cathodic inhibitor for copper at low HCl concentrations (0.01 and 0.001M). The potentiodynamic polarization results revealed that domperidone can be seen as mixed-type or cathodic inhibitor as the HCl concentration changes. Scanning electron microscopy studies indicated the formation of protective films of inhibitor molecule on copper surface. Besides, density functional theory-based quantum chemical calculations and molecular dynamics simulations showed the electronic structure of domperidone and its optimized adsorption configuration on copper surface, which could account for the experimental findings.en_US
dc.language.isoengen_US
dc.publisherTAYLOR & FRANCIS LTDen_US
dc.relation.isversionof10.1080/01694243.2018.1426542en_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectCopperen_US
dc.subjectcorrosionen_US
dc.subjectaciden_US
dc.subjectelectrochemistryen_US
dc.subjectdomperidoneen_US
dc.subjectmolecular simulationen_US
dc.titleAnticorrosion potential of domperidone on copper in different concentration of hydrochloric acid solutionen_US
dc.typearticleen_US
dc.relation.journalJOURNAL OF ADHESION SCIENCE AND TECHNOLOGYen_US
dc.contributor.department[Zhou, Yang -- Zhao, Zhiheng -- Zheng, Sisi -- Xu, Yue -- Xiang, Bin] Chongqing Univ, Coll Chem & Chem Engn, Chongqing, Peoples R China -- [Guo, Lei] Tongren Univ, Sch Mat & Chem Engn, Tongren, Peoples R China -- [Xiang, Bin] Natl Municipal Joint Engn Lab Chem Proc Intensifi, Chongqing, Peoples R China -- [Kaya, Savas] Cumhuriyet Univ, Dept Chem, Fac Sci, Sivas, Turkeyen_US
dc.identifier.volume32en_US
dc.identifier.issue13en_US
dc.identifier.endpage1502en_US
dc.identifier.startpage1485en_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record